Performance materials
This division designs and manufactures electromagnetic interference (EMI) shielding, thermal management and signal integrity products that provide vital protection for a wide range of electronic devices, allowing them to function and connect effectively, whether for voice or visual communication or for high quality data storage and transmission.
Markets served include: IT/datacomms, consumer electronics, telecoms, medical, aerospace and defence, industrial and instrumentation, mobile handsets and automotive/transportation.
- EMI solutions
Electronic devices give off electromagnetic emissions as a by-product of electrical or magnetic activity and such emissions can interfere with the operation of other devices. EMI shielding is necessary to isolate sensitive apparatus from these electromagnetic fields.
Laird Technologies’ EMI product solutions provide shielding around seams and apertures, isolate components and minimise crosstalk and susceptibility without impacting system speed. Our extensive product portfolio includes board level shields, electrically conductive elastomers (ECE), Fabric-Over-Foam shielding gaskets, vent panels, Form-in-Place, microwave absorbers, Electronit Mesh and Fingerstock gaskets.
Read more about our products on the Laird Technologies website in the dedicated section on EMI Solutions
- Thermal Management Solutions
Electronic applications generate heat that can adversely affect a device’s performance. Typically heat is removed through conduction from a component’s surface to a heat sink, cold plate or heat spreader. Laird Technologies’ thermal management materials are engineered to conform to surface irregularities with much higher, thermally conductive materials. This allows the increase of overall heat transfer and removal of air gaps so electronic components run much cooler.
Our range of active/passive heat removal and temperature control products includes gap fillers, phase-change materials and thermally conductive circuit boards. We also offer thermoelectric modules (TEMs) – solid-state heat pumps made of semiconductor materials placed between ceramic insulating plates, as well as thermoelectric assemblies (TEAs) – solid-state heat pumps that utilise the Peltier effect.Read more about our products on the Laird Technologies website in the dedicated section on Thermal Management Solutions
- Signal Integrity Products
Laird Technologies’ ferrite-based product family preserves high quality signal integrity by removing and filtering unwanted or harmful electromagnetic ‘noise’ generated by active components such as oscillators and microprocessors, as well as EMI escaping from any electronic product through DC power lines. Products include standard and custom board level EMI solutions, ferrite cable cores and small ferrite inductor toroids.
Read more about our products on the Laird Technologies website in the dedicated section on SIP and EMI Solutions
- Board Level Shielding Products
Board level shields provide isolation of electronic components to minimise crosstalk and susceptibility without impacting system speed.
With removable lids for component access, custom shapes or tape-and-reel designs for automated pick-and-place applications, board level shields from Laird Technologies make every product more efficient.
We deliver standard or customised products that include traditional metal enclosures, one-piece EZ Peel™ and our new combo products that incorporate a stamped metal housing with an over-molded electrically conductive elastomer designed to meet specific application needs.
Read more about our products on the Laird Technologies website in the dedicated section on Board Level Shielding Products